Paperworld 28^th to 31^st January 2012

     Visit us at the Paperworld
     28^th - 31^st of January 2012 in Frankfurt

     hall 3.0 stand A61

     www.paperworld.messefrankfurt.com

 

 

 

     

     

See the Future ...   RB45U

 

 

INTERPACK in 2011 - a review.

The new modules of the SI-class created big interest. The module showed how the spout can be welded together with the pouch. Now the pouch is completely producible with ultrasonic. That means – finally the packaging is completely recyclable...

The ultrasonic welding technology and its benefits

Ultrasonic technology is an economical and very process efficient solution for the production of pouches, which breaks new ground in many ways.

Read more...